1Q2017 - Patent Sale - Lot 16: Packaging - Contacts

Lot 16 includes 8 patent assets.  The patents in Lot 16 relate to various contacts technologies for IC packaging, including thermocompression bonding techniques and methods of individually reflowing chip interconnects separately.  The patents also relate to bulk metallic glass solder material, peripheral surface mount components, and surface mount connectors with pins and vias.  [Uploaded 30 January 2017.]

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