1Q2017 - Patent Sale - Lot 17: Packaging - Contacts BGA

Lot 17 includes 20 patent assets.  The patents in Lot 17 relate to various ball-grid array (BGA) technologies for IC packaging, including corner-attach heat sinks for BGA packages, methods of sort testing solder-bumped wafers, and package substrates with stepped solder mask openings for stress-reduction. The patents also relate to BGA direct socketing and packaging layers with moisture barrier structures.  [Uploaded 30 January 2017.]

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