1Q2017 - Patent Sale - Lot 18: Packaging - Architecture

Lot 18 includes 20 patent assets.  The patents in Lot 18 relate to various architecture technologies for IC packaging, including low profile packages with enclosed power supplies, stacked microelectronic packages, and wireless connections for IC packages.  The patents also relate to package interconnects with thermoelectric coolers.  [Uploaded 30 January 2017.]


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