1Q2017 - Patent Sale - Lot 20: Packaging - Heat Sink

Lot 20 includes 11 patent assets.  The patents in Lot 20 relate to various heat sink technologies for IC packaging, including solderable heat sinks with connecting pins, electroosmotic cooling pumps, and liquid cooling devices directly bonded to IC dies.  The patents also relate to heat sinks with oscillating fins and backside-mounted heat sinks.  [Uploaded 30 January 2017.]


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