ROI-20-0995 Beyond Blades Ltd: 3D Modular Computer Architecture - 5 assets

3 US issued patents and 2 international counterparts (CA, EP) related to a 3-Dimensional Multi-layered Modular Computer Architecture intended for providing a computer architecture that significantly improves computer mass, volume and power densities through the use of 3-Dimensional layered structure instead of traditional 2-Dimensional Printed Circuit Board structure.

More package details are available upon request.

Asset list:

US8274792B2 

US9164555B2

US10067539B2

EP1934668B1

CA2621505C

 

Package data provided by Richardson Oliver Insights.

Contact info: Justin Ehrlickman, +1 (845)-558-7901, justin@ipapproach.com

Transactions: 

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