ROI-20-0995 Beyond Blades Ltd: 3D Modular Computer Architecture - 5 assets
3 US issued patents and 2 international counterparts (CA, EP) related to a 3-Dimensional Multi-layered Modular Computer Architecture intended for providing a computer architecture that significantly improves computer mass, volume and power densities through the use of 3-Dimensional layered structure instead of traditional 2-Dimensional Printed Circuit Board structure.
More package details are available upon request.
Asset list:
US8274792B2
US9164555B2
US10067539B2
EP1934668B1
CA2621505C
Package data provided by Richardson Oliver Insights.
Contact info: Justin Ehrlickman, +1 (845)-558-7901, justin@ipapproach.com
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