Browse IP/tech

Lot 16 includes 8 patent assets. The patents in Lot 16 relate to various contacts technologies for IC packaging, including thermocompression bonding techniques and methods of individually reflowing..

Lot 17 includes 20 patent assets. The patents in Lot 17 relate to various ball-grid array (BGA) technologies for IC packaging, including corner-attach heat sinks for BGA packages, methods of sort..

Lot 18 includes 20 patent assets. The patents in Lot 18 relate to various architecture technologies for IC packaging, including low profile packages with enclosed power supplies, stacked..

Lot 19 includes 13 patent assets. The patents in Lot 19 relate to various packaging substrate technologies for IC packaging. Represented technologies include packages with enclosed capacitors and..

Lot 20 includes 11 patent assets. The patents in Lot 20 relate to various heat sink technologies for IC packaging, including solderable heat sinks with connecting pins, electroosmotic cooling pumps,..

Lot 21 includes 10 patent assets. The patents in Lot 21 relate to packaging technology. Representative technologies include packaging structures having improved signal transmission characteristics,..

Lot 22 includes 8 patent assets. The patents in Lot 22 relate to multi-core processors. Representative technologies are directed to improvements in interrupt processing, memory management, and I/O..

Lot 23 includes 12 patent assets. The patents in Lot 23 relate to security and encryption, including ways to manage security of encrypted content and techniques for ensuring data security in virtual..

Lot 24 includes 9 patent assets. The patents in Lot 24 relate to near field communications and wireless charging. Representative technologies include the architecture of a wireless reader device, and..

Lot 25 includes 9 patent assets. The patents in Lot 25 relate to a processor instruction for translating virtual memory addresses to physical memory addresses. [Uploaded 30 November 2018.]

This portfolio comprises 695 CN patents assigned to Foxconn Technology Group and covers multiple technical categories.

This Sharp portfolio comprises 30 issued US patents across 49 families with counterparts in Japan and Korea. The technology in the portfolio relates to magnetic recording media and magnetic head..

Summary : This portfolio is a collection of patents featuring many aspects of biometric authentication (e.g. fingerprint, face). Among those listed in a patent list, US8045767 relates to swipe..

Lot 26 includes 6 patents related to cache memory. Representative technologies include reducing storage overhead of cache memories containing error correction codes, a replacement policy for hot code..

Lot 27 includes 12 patent assets in 3 families. The patents relate to conserving power in microprocessors. Representative technologies include placing a memory in self-refresh mode and using activity..

This portfolio includes 46 US issued patents. This portfolio offers benefits for connector.

This portfolio providing 4 patent families including 2 US issued patents, 4 CN patentss, and 4 TW patents. This portfolio offers benefits for fingerprint recognition.

2 US patents and 1 US application relating to resource access control. No encumbrances. Broker package summary including identified exemplary players and products available upon request. Package data..

3 US patents across 2 families related to user authentication; authenticating and classifying a user using stateless biometric methods, and non-invasive monitoring food intake utilizing sensors and..

1 US patent related to a lighting system comprising movement system, light source repositionable via the movement system, sensor, controller, and a communication system. No encumbrances. Broker..