Browse IP/tech

Lot 16 includes 8 patent assets. The patents in Lot 16 relate to various contacts technologies for IC packaging, including thermocompression bonding techniques and methods of individually reflowing..

Lot 17 includes 20 patent assets. The patents in Lot 17 relate to various ball-grid array (BGA) technologies for IC packaging, including corner-attach heat sinks for BGA packages, methods of sort..

Lot 18 includes 20 patent assets. The patents in Lot 18 relate to various architecture technologies for IC packaging, including low profile packages with enclosed power supplies, stacked..

Lot 19 includes 13 patent assets. The patents in Lot 19 relate to various packaging substrate technologies for IC packaging. Represented technologies include packages with enclosed capacitors and..

Lot 20 includes 11 patent assets. The patents in Lot 20 relate to various heat sink technologies for IC packaging, including solderable heat sinks with connecting pins, electroosmotic cooling pumps,..

Lot 21 includes 10 patent assets. The patents in Lot 21 relate to packaging technology. Representative technologies include packaging structures having improved signal transmission characteristics,..

This portfolio comprises 695 CN patents assigned to Foxconn Technology Group and covers multiple technical categories.

This portfolio comprises 36 patent families covering US, China, and Japan patents. The technology in this portfolio relates to flapping robot and ultrasonic motor. The main feature is flapping..

Summary : This portfolio is a collection of patents featuring many aspects of biometric authentication (e.g. fingerprint, face). Among those listed in a patent list, US8045767 relates to swipe..

This technology and patents cover an atmospheric pressure plasma apparatus comprised of a porous electrode that allows the plasma to pass through the channel of the apparatus and does not require the..

This portfolio includes 7 US issued patents. This portfolio offers benefits for surface treatment technology.

This portfolio providing 46 patent families including 40 US issued patents, 5 CN issued patents, and 6 TW issued patents.

The portfolio consists of 82 patent families which includes 78 US utility patents assigned to Foxsemicon Integrated Technology, Inc. Major markets impacted: LED Chip Structure and Package Backlight..

2 US issued patents, 8 international patents (RU, JP, EP, CN, AU, CA) and 4 applications (AU, IL, WO) related to a method of heat treating magnesium alloys and magnesium grain refining using vanadium..

1 US issued patent related to a welding electrode holder comprising handle and electrode clamps extending nearly perpendicularly from the handle to provide easy loading and unloading of electrodes,..

Summary: The patent portfolio includes patents related to non-volatile semiconductor memory technology. Representative Patents: US 6566698 / US 6949788 Potential buyers: ・Semiconductor foundries ・..