Browse IP/tech

Lot 16 includes 8 patent assets. The patents in Lot 16 relate to various contacts technologies for IC packaging, including thermocompression bonding techniques and methods of individually reflowing..

Lot 17 includes 20 patent assets. The patents in Lot 17 relate to various ball-grid array (BGA) technologies for IC packaging, including corner-attach heat sinks for BGA packages, methods of sort..

Lot 18 includes 20 patent assets. The patents in Lot 18 relate to various architecture technologies for IC packaging, including low profile packages with enclosed power supplies, stacked..

Lot 19 includes 13 patent assets. The patents in Lot 19 relate to various packaging substrate technologies for IC packaging. Represented technologies include packages with enclosed capacitors and..

Lot 20 includes 11 patent assets. The patents in Lot 20 relate to various heat sink technologies for IC packaging, including solderable heat sinks with connecting pins, electroosmotic cooling pumps,..

Please contact ipmglobalpatenttech@exchange.boeing.com for details. The materials provided are intended to gather interest in discussing our IP and do not constitute an offer. The patents cover an..

Lot 22 includes 8 patent assets. The patents in Lot 22 relate to multi-core processors. Representative technologies are directed to improvements in interrupt processing, memory management, and I/O..

Lot 23 includes 12 patent assets. The patents in Lot 23 relate to security and encryption, including ways to manage security of encrypted content and techniques for ensuring data security in virtual..

Lot 24 includes 9 patent assets. The patents in Lot 24 relate to near field communications and wireless charging. Representative technologies include the architecture of a wireless reader device, and..

Lot 25 includes 9 patent assets. The patents in Lot 25 relate to a processor instruction for translating virtual memory addresses to physical memory addresses. [Uploaded 30 November 2018.]

This portfolio comprises 695 CN patents assigned to Foxconn Technology Group and covers multiple technical categories.

Summary: This portfolio covers wide range of camera related technology. US6522361 is useful for displaying the battery residual quantity. US7202892 is useful for producing an image based on a..

New composite applications often require adoption of complex geometries to meet novel structural demands. Boeing offers innovative processes-tooling in continuous compression molding for..

Device type services and capabilities updates.

This portfolio comprises 36 patent families covering US, China, and Japan patents. The technology in this portfolio relates to flapping robot and ultrasonic motor. The main feature is flapping..

Patents relating to cellular technologies (including 3G/4G/LTE, and mobile handsets); UMTS technologies (including HLR, VLR, service function chaining, hot spot operations, and Call management); 802..

Patents relating to network security, cyber security, traffic and file security, device encryption, authentication, etc.; Exemplary Patent: US 6772349 Contact us to learn more about HPE’s patent sale..

Patents relating to solar charging, battery charge management, next/emerging (3rd) generation solar cell device structures incorporating non-technologies, etc.; Contact us to learn more about HPE’s..

Summary : This portfolio is a collection of patents featuring many aspects of biometric authentication (e.g. fingerprint, face). Among those listed in a patent list, US8045767 relates to swipe..

This portfolio includes 18 US issued patents. This portfolio offers benefits for power supply protection circuit.