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  • Method for reclaiming a surface of a substrate

    Available in CN, DE, FR, JP, KR, SG, TW, US Invention : Even though it is possible to obtain a recycled substrate that can be reused in the Smart Cut™ process using the reclaiming process described..
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  • Process for fabricating a substrate of the SOI type with reduced roughness and uniform thickness

    Available in DE, FR, SG, US Invention : The invention provides a fabrication process which makes it possible to obtain a SOI substrate, the thin silicon active layer of which has surface roughness..
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  • Process for manufacturing a composite structure

    Available in CN, FR, JP, KR, RU, SG, US, EP Invention : The composite structure obtained allows creep of a useful layer, by executing a heat treatment, for example, so as to encapsulate the covering..
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  • Substrate Conformal Imprinting Lithography | Philips

    SCIL stands for ‘Substrate Conformal Imprinting Lithography’, a cost effective, robust, high yield process enabling nanometer resolution on a large variety of substrates. Satisfying the rapidly..
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