E0216_Sharp Semiconductor

This portfolio is assigned to Sharp Corporation. The technology in this portfolio relates to semiconductor package or stacked chip package technology. The main feature is package technology of semiconductor chip in BGA (Ball Grid Array) type or CSP (Chip Size Package) type devices relating to widely adopted technology for the needs of miniaturizing electronic equipment such as a CPU (Central Processing Unit) or an LSI (Large Scale Integrated circuit). This portfolio comprises 5 granted US patents across 3 families with counterparts in Japan, Korea, and Taiwan. Please find attached the patent list. Evidence of Use is available under NDA.

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