Substrate Conformal Imprinting Lithography

SCIL stands for ‘Substrate Conformal Imprinting Lithography’, a cost effective, robust, high yield process enabling nanometer resolution on a large variety of substrates. Satisfying the rapidly increasing demand for products with nano imprinted components, SCIL delivers proven, high quality imprints on large areas up to 200 mm. It can be used to make nano and micro patterns with feature sizes down to less than 10 nm. And because of the unique properties of the imprint resist, SCIL saves time by directly producing a hard-etch mask or functional layer.

Unlike conventional lithography processes, SCIL has fewer defects Compared to other imprint lithography processes SCIL causes less damage to the materials thanks to its soft conformal stamp. Patterns are imprinted over particle contaminants and distortions are dissipated in the soft rubber layer. Improving yield, this results in lower operation cost and high quality output of your products.

Optimum performance

Our scalable process reduces your risks from concept to volume manufacture by using compatible processes and materials. Essentially, optimal equipment design ensures optimal output with optimal cost performance. So, you can jump-start your products in the market and guarantee that your solutions will be of the highest quality.

We provide you with:

  • Tooling and processes for small series and high volume production
  • Mature supply chain of consumables (stamp and imprint materia
  • Dedicated processes for your requirement

How it works

Our technologies for enabling SCIL include the stamp’s top layer component of X-PDMS, which facilitates fine detail, low pressure imprinting. Low pressure and zero damage characteristics are further enhanced through a choice of patented sol-gel resists, applied by capillary action. Lastly, for large volume production the complete process is carried out by our automated lithography tool, capable of manufacturing up to 60 wafers per hour.


Nanometre resolution patterns are possible due to the tri-layer stamp construction. Our X-PDMS (polydimethylsiloxane) top layer which carries the imprint structure is added to your chosen middle and bottom layers of soft PDMS and thin glass, respectively.

In this way, the stamp achieves conformal (full wafer contact) imprinting at low pressure. It is flexible enough to follow substrate unevenness while being rigid enough to create nano structures without any deformation. The X-PDMS is also soft enough for peel removing during sequential low force stamp release.

Imprint material

Our special inorganic sol-gel resist material is optically transparent, and UV and temperature stable. It can be used both as hard etch mask and as a functional layer.

  • Good etch resistance: Directly patterned hard mask (saves two process steps)
  • Good thermal stability: Directly patterned functional layers (transparency makes it suitable for optical applications from UV to IR)

Imprint method

Ensuring low pattern deformation, the capillary force driven imprint process only uses a low pressure imprint cycle. It also ensures that the imprinting direction is always vertical. After the resist has hardened the stamp is released in a smooth peeling action.

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