Intel Corporation IP/tech

Lot 16 includes 8 patent assets. The patents in Lot 16 relate to various contacts technologies for IC packaging, including thermocompression bonding techniques and methods of individually reflowing..

Lot 17 includes 20 patent assets. The patents in Lot 17 relate to various ball-grid array (BGA) technologies for IC packaging, including corner-attach heat sinks for BGA packages, methods of sort..

Lot 18 includes 20 patent assets. The patents in Lot 18 relate to various architecture technologies for IC packaging, including low profile packages with enclosed power supplies, stacked..

Lot 19 includes 13 patent assets. The patents in Lot 19 relate to various packaging substrate technologies for IC packaging. Represented technologies include packages with enclosed capacitors and..

Lot 20 includes 11 patent assets. The patents in Lot 20 relate to various heat sink technologies for IC packaging, including solderable heat sinks with connecting pins, electroosmotic cooling pumps,..

Lot 21 includes 10 patent assets. The patents in Lot 21 relate to packaging technology. Representative technologies include packaging structures having improved signal transmission characteristics,..

Lot 22 includes 8 patent assets. The patents in Lot 22 relate to multi-core processors. Representative technologies are directed to improvements in interrupt processing, memory management, and I/O..

Lot 23 includes 12 patent assets. The patents in Lot 23 relate to security and encryption, including ways to manage security of encrypted content and techniques for ensuring data security in virtual..

Lot 24 includes 9 patent assets. The patents in Lot 24 relate to near field communications and wireless charging. Representative technologies include the architecture of a wireless reader device, and..

Lot 25 includes 9 patent assets. The patents in Lot 25 relate to a processor instruction for translating virtual memory addresses to physical memory addresses. [Uploaded 30 November 2018.]